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Found 50 business articles.
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China: Rule-taker, Rule-shaker or Rule-maker?
8-August-2016

Despite its ascent on the world stage, research conducted by Researcher from Singapore Management University shows that China may prefer to keep a low profile in global organisations.

Read more of the article entitled 'China: Rule-taker, Rule-shaker or Rule-maker?'

Contact: Office of Research Institution: Singapore Management University
 
Unveiling Informal Business Networks
8-August-2016

Researcher from Singapore Management University is uncovering the implications of informal business networks between top executives and their independent auditors.

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Contact: Office of Research Institution: Singapore Management University
 
Hotel social rewards generate sustainable customer loyalty
4-August-2016

Hotels usually offer rewards to customers in form of economic or social benefits. Researchers in Hong Kong have recently conducted a study to explore how customers perceive different types of rewards and how those perceptions influence customer loyalty.

Read more of the article entitled 'Hotel social rewards generate sustainable customer loyalty '

Contact: The Hong Kong Polytechnic University Institution: The Hong Kong Polytechnic University
 
Universities, government and industry join hands to form a sustainable urban development consortium
6-July-2016

July 6, 2016: The University-Government-Industry Consortium for Sustainable Urban Development (UGI Consortium) was officially launched today in the Hong Kong Polytechnic University (PolyU) with strong support from local universities, government departments and industry.

Read more of the article entitled 'Universities, government and industry join hands to form a sustainable urban development consortium '

Contact: The Hong Kong Polytechnic University Institution: The Hong Kong Polytechnic University
 
A*STAR’s IME launches Chip-on-Wafer Consortium II and cost-effective interposer consortium to advance chip packaging solutions for high-volume manufacturing
4-July-2016

Industry-focused consortia will address key challenges in wafer-level packaging to lower overall manufacturing costs and accelerate time-to-market of next-generation electronic devices.

Read more of the article entitled ' A*STAR’s IME launches Chip-on-Wafer Consortium II and cost-effective interposer consortium to advance chip packaging solutions for high-volume manufacturing '

Contact: A*STAR Research Institution: The Agency for Science, Technology and Research (A*STAR)
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