Found 50 business articles.
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Malaysian researchers create new durable wood-plastic composite material.9-October-2012
Researchers from the Universiti Teknologi MARA in Malaysia have created a new durable wood-plastic composite (WPC). Recent discoveries in the production of new materials have enabled researchers to develop new types of composite materials that perform better and are more durable.Contact: Darmarajah Nadarajah Institution: Universiti Teknologi MARA (UiTM)
British Embassy Tokyo Science & Innovation Newsletter4-September-2012
The August issue of the monthly newsletter from the Science & Innovation Section of the British Embassy has been released. This month's article is "The Japan Revitalisation Plan". The newsletter also includes news headlines from Japanese S&I press and details of forthcoming events.Contact: Administrator Account Institution: ResearchSEA
Institute of Microelectronics teams up with MOSIS to offer photonics MPW to advance silicon photonics research30-August-2012
Institute of Microelectronics (IME) has signed a Memorandum of Understanding (MOU) with MOSIS, a provider of low-cost prototyping and small volume production services for custom ICs, to offer its multiple-project wafer (MPW) service to MOSIS’ customers.Contact: Bernadette Lee Institution: The Agency for Science, Technology and Research (A*STAR)
Tornado Medical Systems and A*Star’s Institute Of Microelectronics Partner To Commercialise Nanospectrometers For Optical Coherence Tomography Applications28-August-2012
Toronto, Ontario; Ithaca, NY; Singapore, August 28th, 2012 - Optical coherence tomography (OCT) has attracted interest from the medical imaging community for its ability to provide live 3D images at near microscopic levels, offering an ‘optical ultrasound’ alternative for doctors.
A*STAR Institute of Microelectronics and Huawei announce joint effort to develop 2.5D/3D through through-silicon interposer technology17-August-2012
A*STAR Institute of Microelectronics (IME) and Futurewei Technologies, Inc., a subsidiary of Huawei Technologies Co., Ltd. (Huawei), have signed a Memorandum Of Understanding (MOU) to develop and advance Through Silicon Interposer (TSI) technology.Contact: Lee Swee Heng Institution: The Agency for Science, Technology and Research (A*STAR)
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