Home page

Researchers from the Universiti Teknologi MARA in Malaysia have created a new durable wood-plastic composite (WPC). Recent discoveries in the production of new materials have enabled researchers to develop new types of composite materials that perform better and are more durable.

Read more of the article entitled 'Malaysian researchers create new durable wood-plastic composite material.'

The August issue of the monthly newsletter from the Science & Innovation Section of the British Embassy has been released. This month's article is "The Japan Revitalisation Plan". The newsletter also includes news headlines from Japanese S&I press and details of forthcoming events.

Read more of the article entitled 'British Embassy Tokyo Science & Innovation Newsletter '

Institute of Microelectronics (IME) has signed a Memorandum of Understanding (MOU) with MOSIS, a provider of low-cost prototyping and small volume production services for custom ICs, to offer its multiple-project wafer (MPW) service to MOSIS’ customers.

Read more of the article entitled 'Institute of Microelectronics teams up with MOSIS to offer photonics MPW to advance silicon photonics research'

Toronto, Ontario; Ithaca, NY; Singapore, August 28th, 2012 - Optical coherence tomography (OCT) has attracted interest from the medical imaging community for its ability to provide live 3D images at near microscopic levels, offering an ‘optical ultrasound’ alternative for doctors.

Read more of the article entitled 'Tornado Medical Systems and A*Star’s Institute Of Microelectronics Partner To Commercialise Nanospectrometers For Optical Coherence Tomography Applications'

A*STAR Institute of Microelectronics (IME) and Futurewei Technologies, Inc., a subsidiary of Huawei Technologies Co., Ltd. (Huawei), have signed a Memorandum Of Understanding (MOU) to develop and advance Through Silicon Interposer (TSI) technology.

Read more of the article entitled 'A*STAR Institute of Microelectronics and Huawei announce joint effort to develop 2.5D/3D through through-silicon interposer technology'