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A computer model provides important clues for the production of tightly packed electronic components

Read more of the article entitled 'Computer chips: Building upward safely'

Singapore, 27 March - A*STAR’s IME and United Test and Assembly Center (UTAC), announced a collaboration to develop a 2.5D Through-Silicon-Interposer (TSI) platform which will enable UTAC to join the scarce list of suppliers in offering fine-pitch 2.5D TSI packaging solutions.

Read more of the article entitled 'Singapore's UTAC to co-develop 2.5D Through-Silicon-Interposer with A*STAR’s Institute of Microelectronics for volume manufacturing'

Singapore and Tokyo, 26 March – Singapore’s A*STAR, and Fujitsu Limited (Fujitsu) have signed a MoU to explore the creation of the first Centre of Excellence for Computational Social Science and Engineering in Singapore to identify technological solutions for sustainable urban development.

Read more of the article entitled 'A*STAR and Fujitsu Set Up First Centre of Excellence to Build A Greener Singapore '

The consortium aims to improve the reliability of semiconductor devices by tackling copper wire bonding issues related to corrosion and stress. Members of this consortium span across the semiconductor supply chain including Atotech S.E.A., GLOBALFOUNDRIES, Heraeus Materials and Infineon Technologies.

Read more of the article entitled 'Institute of Microelectronics kicks off copper wire bonding consortium II to tackle copper interconnects reliability issues'

A project supported by the Canadian International Food Security Research Fund (CIFSRF) is helping smallholder shrimp farmers in Sri Lanka adapt their industry’s best management practices to local needs. This could lead to fewer disease outbreaks, bigger and more profitable shrimp, and fewer negative environmental impacts.

Read more of the article entitled 'Research with Sri Lankan fish farmers brings best practices home'