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Defects in metal–organic frameworks induce low-temperature ferromagnetism and could yield novel materials for industry

Read more of the article entitled 'Materials: Magnetic mystery solved'

Microstructures made of adjoining semiconductor disks could lead to powerful nanoscale sensors

Read more of the article entitled 'Semiconductors: Touching moments with a radiant outcome'

A revolutionary atmospheric-pressure plasma boosts adhesion of polymer films for roll-to-roll solar-cell production

Read more of the article entitled 'Manufacturing: Plasma treatments on a roll'

A computer model provides important clues for the production of tightly packed electronic components

Read more of the article entitled 'Computer chips: Building upward safely'

Singapore, 27 March - A*STAR’s IME and United Test and Assembly Center (UTAC), announced a collaboration to develop a 2.5D Through-Silicon-Interposer (TSI) platform which will enable UTAC to join the scarce list of suppliers in offering fine-pitch 2.5D TSI packaging solutions.

Read more of the article entitled 'Singapore's UTAC to co-develop 2.5D Through-Silicon-Interposer with A*STAR’s Institute of Microelectronics for volume manufacturing'